Application

Bond Application

----

Download PDF

See Application Exhibits

Applications that are complete and accurate will be promptly reviewed and acted upon by the Board of Directors. A non-refundable application fee must accompany a completed application upon submission. Submit completed application to wribley@sidail.com.

Bond Fees:

  • Application Fee- A $2,000 non-refundable application fee is due when the application is submitted.
  • Issuance Fee- This service fee is 80 Basis Points (0.0080) x bond amount on Private Entities issues
    and 40 Basis Points (.0040) x bond amount on Not-for-Profit Issues, and 15 Basis Points (.0015) x
    bond amount on Government issues.
  • Other miscellaneous fees include the cost of the Issuer and Underwriter / Lender Bond Counsel.

Fee payments are payable to Southern Illinois Economic Development Authority (SIDA) and sent to SIDA Office: PO Box 9079, Springfield, IL 62791.